Hybrid packages are used for high quality or sensitive microelectronics.
These housings enable electrical connections from the hermetic interior to the outside environment by using glass-to-metal sealed pins or leads. The hermetic packages, with their glass seals, protect electronic components from aggressive environments and influences such as gas, microwave radiation, sparks, and liquids. We offer many different standard or specialised customer oriented solutions to meet the required specifications.
Due to our streamlined, efficient structure and development service, we are able to produce prototypes fast and economically.
As mentioned previously, the best materials and production methods are chosen right from the beginning to ensure small scale and mass production at the best quality/price ratio.
More details on the design and construction of hybrid packages can be found on the download page.
92224 Amberg, Germany
Telephone: +49 (0)9621- 81067
Faxr: +49 (0)9621- 84400